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Stress Analysis for ceramic PCB type boards under temperature cycling

I am new to Wolfram but am looking for a way to model a ceramic printed circuit type board with thick copper foil on two sides under temperature cycling conditions to study ceramic cracking. Can someone suggest a consultant or the Wolfram modules needed to develop a mathematical model?

Thank you Ron

POSTED BY: Ronald Visser
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Thank you Vitally -

I appreciate your advice. Will do.

Ron

POSTED BY: Ronald Visser
POSTED BY: Vitaliy Kaurov
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